The rapid advancements in graphics processing unit (GPUs) and High-bandwidth Memory (HBM) have significantly increased the complexity and technological requirements for chip packaging in recent years. Advanced downstream packaging business will increasingly become more significant to the revenue and profit mix among foundries and integrated device manufacturers (IDMs).
- Foundries and IDMs are expanding into advanced packaging to capture new business opportunities.
- Advanced packaging is a new growth area for foundries and it is expected to outpace the growth rate of traditional packaging.
- Packaging as new contributor in addition to wafer fabrication, overall foundry revenue to register strong growth in 2024.
Foundries, and integrated device manufacturers (IDMs).
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